Advanced Packagingfeatures news and resources for engineers involved in microelectronics packaging materials and technologies, and provides a unique perspective on the design and fabrication of advanced electronic component packaging. The magazine's technology-specific coverage focuses on the engineering drive for smaller, faster, more reliable and cost-effective packaging solutions.
12 Issues per year---Now Available for Delivery WorldWide!

Please Note: To qualify for this free trade publication, you will be required to fill out a separate application form after you check out. Be sure to look for the pop-up link about Free Trade Magazines on the order confirmation page.